Reflow Temperature Profile

During Reflow Process

During Pre-Heat Process

Peak Temperature / Time

240°C / within 5sec

150°C ~ 180°C


For Temperature above 230°C


Testing Point

Product Surface


Product Storage Condition

10°C ~ 40°C, within 30~60%RH

*Note: While using the above recommended Reflow Temperature with the appropriate soldering paste, please limit this process to two (2) times only to achieve optimal result.