Reflow Temperature Profile
During Reflow Process |
During Pre-Heat Process |
||
|---|---|---|---|
Peak Temperature / Time |
240°C / within 5sec |
150°C ~ 180°C |
90±30sec |
For Temperature above 230°C |
20±10sec |
Testing Point |
Product Surface |
Product Storage Condition |
10°C ~ 40°C, within 30~60%RH |
||
*Note: While using the above recommended Reflow Temperature with the appropriate soldering paste, please limit this process to two (2) times only to achieve optimal result.
